Die Pad (center pad)
The die pad or center pad is visible from below and located in the center of the package. It is electrically connected to
VSS. Hence electrical considerations do not impose constraints on the wiring of the die pad. However, due to mechanical
reasons it is recommended to solder the center pad to the PCB. For more information on design-in, please refer to the
document “SHTxx Design Guide”.
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The die pad or center pad is visible from below and located in the center of the package. It is electrically connected to
VSS. Hence electrical considerations do not impose constraints on the wiring of the die pad. However, due to mechanical
reasons it is recommended to solder the center pad to the PCB. For more information on design-in, please refer to the
document “SHTxx Design Guide”.
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