MT8167芯片PCB设计指南 PCB Design Guidelines for MT8167 Outlines
2017/3/23 Copyright © MediaTek Inc，All rights reserved， 3
 Packaging
− Package outline of MT8167
− MT8167 footprint recommendation
− MT8167 ball out design
 General Guidelines
− PCB stack-up recommendation
− Placement notes
− MT8167 fan out
 Design Guidelines for High-Speed Digital Signals
− PCDDR3
− PCDDR3x8x4ps
− PCDDR4
− LPDDR3
− PDN design
 Others
− MT6392 (PMU)
− BT/Wi-Fi, 26MHz CLK
− Audio, eMMC, SD card, MIPI, HDMI, LVDS, USB
loginid=molbasic01@ginreen.com,time=2017-09-12 16:43:52,ip=113.87.89.237,doctitle=MT8167 PCB Design Guidelines--English--V1_0.pdf,company=Ginreen-Tablet
INTERNAL USE
Outlines
2017/3/23 Copyright © MediaTek Inc，All rights reserved， 4
 Packaging
− Package outline of MT8167
− MT8167 footprint recommendation
− MT8167 ball out design MT8167 FootprintRecommendation 需要mtk芯片资料的可以加Q群：813238832 Note:
• Use copper defined for all solder pads (see Figure 1).
• Recommended stencil opening 0.27mm (see green area in Figure 2)

Recommend PCBStack-up: 4L_THV_1.0mm If the thickness needs adjustment, please maintain the quality of DDR signal and keep the same dielectric thickness between L1 and L2 and between L3 and L4. 余下内容（MT8167）可点击下载：http://bbs.uuzcc.com/forum-321-1.html