补充点写手册资料
The MPU-60X0 has very low active and standby current consumption. The exposed die pad is not required for heat sinking, and should not be soldered to the PCB. Failure to adhere to this rule can induce performance changes due to package thermo-mechanical stress. There is no electrical connection between the pad and the CMOS.
我的做法就是中间是一个单独焊盘，问题就是布线收到影响。
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手册看好 一下午过去了，还不知道能不能找到答案。
The MPU-60X0 has very low active and standby current consumption. The exposed die pad is not required for heat sinking, and should not be soldered to the PCB. Failure to adhere to this rule can induce performance changes due to package thermo-mechanical stress. There is no electrical connection between the pad and the CMOS.
我的做法就是中间是一个单独焊盘，问题就是布线收到影响。
那就在底下开个散热口？
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